Product Engineer – Photonics Packaging

General overview

About Us

Where Light Meets Digital – EFFECT Photonics is a highly vertically integrated, independent photonic semiconductor company addressing the need for high-performance, affordable optic solutions driven by the ever-increasing demand for bandwidth and faster data transfer capabilities. Our teams are made up of professional, highly skilled, energized, and enthusiastic people who share a passion for developing and creating high-volume, world-class solutions. We operate globally, and our teams work collaboratively to make EFFECT Photonics a very dynamic and rewarding place to work.

About the Position

Effect Photonics is looking for a hands-on Product Engineer for Photonics Packaging. You will join a small team and play a pivotal role in the design, development, testing, and validation of cutting-edge photonic components for telecom and datacom, including tuneable lasers and other photonics integrated circuits. We are looking for a subject matter expert who will work closely with cross-functional teams, including the PIC and product design teams in Eindhoven, and contract manufacturers, to ensure products meet the required performance, cost, and yield.

Role responsibilities

• Be the gatekeeper for DFX in communications between Engineering, PLM, Quality and CM. Evaluate design specifications to ensure components meet performance, reliability, and manufacturing requirements.
• Work with CMs towards optimum assembly processes and process flow definition, with the CM being the domain experts.
• Own product BOMs and other relevant documentation as they transition from design into volume production. Maintain detailed documentation.
• Ensure product quality by critical review of control plans and 8D procedures.
• Drive yield together with our contract manufacturers.
• Lead factory product training and troubleshooting as part of NPI.
• Be part of technical investigations and DoE definitions.
• Proactively identify and implement improvements in design, testing, and manufacturing processes to optimize performance and cost.

Requirements

Required / Desired knowledge, skills, and abilities

• Degree in Physics, Electrical Engineering, or related field.
• Rich domain experience driving outsource teams implementing SMT, hermetic packaging processes and technologies – Die bonding, Wire bonding, Seam sealing, Optical Alignment/Fibre coupling.
• Deep experience working with offshore contract manufacturing and can demonstrate multiple new product launches.
• Demonstrated experience working with Optical components – lasers and PICs a plus.
• Strong knowledge of testing, validation, and troubleshooting methodologies in the context of trainingtroubleshooting.
• Ability to use Solidworks, edraw, Zemax or other CAD tools.
• Experience in thermal modelling is a big plus.
• Proficiency with data analysis platforms like JMP and Dashboarding Tools such as PowerBI to articulate complex data sets and drive actionable insights.
• Knowledge of Lean principles and Quality tools e.g. 8D, PFMEA, Fishbone, Control Plans
• Excellent communication skills, both written and verbal.
• WillingnessAbility to travel internationally ~15-20%

We are a collaborative Global Technology Company, and we’re building a truly dynamic and rewarding place to work.

Reward and Benefits

Benefits are a critical component to consider when taking on a new challenge, but because we are a global company, benefits may vary by location.

Here’s what you can expect from us regardless:

• An exciting working culture where everyone’s point of view has real value
• An environment that embraces collaboration
• A competitive salary that reflects our ambition
• Paid time off (vacation days) plus statutory annual holidays
• Stock Appreciation Rights (SAR – stock program)